Koelingonderdelen voor computersystemen (497)

Koeler voor processor, (voor: LGA1156, AM2, AM2+, LGA1366, AM3, LGA1155, AM3+, FM1, FM2, LGA1150, LGA1151, AM4, LGA1200), aluminium, 120 mm

Koeler voor processor, (voor: LGA3647), aluminium, 60 mm, 2U

Koeler voor processor, (voor: LGA3647), aluminium en koper, 80 mm, 3U

Koeler voor processor, (voor: LGA3647), aluminium, 80 mm

Dynatron A-18 Processor Luchtkoeler 7 cm Koper, Grijs

Koeler voor processor, (voor: TR4, SP3), aluminium, 80 mm

Koeler voor processor, (voor: TR4, SP3, sTRX4), aluminium, 60 mm

Koeler voor processor, passief, (voor: LGA4189), koperen koelbuis, 2U

null

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %. Most excellent thermal conductivity No bleeding long-term stability high compression rate The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. NB: Due to the consistency only one-time use is recommended

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %. Most excellent thermal conductivity No bleeding long-term stability high compression rate The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. NB: Due to the consistency only one-time use is recommended

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %. Most excellent thermal conductivity No bleeding long-term stability high compression rate The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. NB: Due to the consistency only one-time use is recommended

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %. Most excellent thermal conductivity No bleeding long-term stability high compression rate The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. NB: Due to the consistency only one-time use is recommended

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %. Most excellent thermal conductivity No bleeding long-term stability high compression rate The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. NB: Due to the consistency only one-time use is recommended

De Ryzen 7000 Delid-Die-Mate is een tool om veilig de heat spreader van de Ryzen 7000 processors te verwijderen. Door het verwijderen van de heat spreader kunnen de CPU's bijvoorbeeld worden gekoeld via Direct Die. Met Direct Die wordt de CPU-koeler direct op de CPU-chiplets en I/O-die gemonteerd, wat zorgt voor een aanzienlijk geoptimaliseerde warmteoverdracht. VERVALT DE GARANTIE Door het delidden van uw CPU vervalt uw garantie - gebruik deze Delid-Die-Mate tool op eigen risico

The practical AM5 Adapter & Offset Mounting Kit for AMD‘s socket AM5 motherboards includes cooler brackets for offset mounting of the CPU as well as adapter screws from UNC 6-32 to M3 and M4 threads respectively. The adapter screws can be used to mount CPU coolers that require an M3 or M4 thread instead of the UNC 6-32 thread of the mounting screws of the cooler bracket, as is the case with various AIOs or water coolers. With the offset brackets, compatible CPU coolers can optionally be mounted offset on the processor to optimise cooling performance. Since the introduction of the chiplet design in Ryzen CPUs, the hottest point of the heat spreader is no longer in the middle, but has been offset slightly downwards and, depending on the CPU, towards the edge.

The Delid-Die-Mate Intel 13th Gen is a tool for removing the heat spreader (delidden) on Intel processors for socket LGA1700. By removing the heat spreader, the CPUs can be cooled via direct die, for example. With the so-called direct die, the CPU cooler is mounted directly on the processor chip. By omitting the heat spreader in the cooling circuit, a significantly optimised heat transfer from the die to the CPU cooler is possible. VOIDS WARRANTY When delidding your CPU you void your warranty - using this Delid-Die-Mate tool at your own risk

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity. This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible. Outstanding thermal conductivity Easy to use Consistently high performance Extreme durability Attention: Electrically conductive! Follow instructions!

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity. This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible. Outstanding thermal conductivity Easy to use Consistently high performance Extreme durability Attention: Electrically conductive! Follow instructions!

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity. This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible. Outstanding thermal conductivity Easy to use Consistently high performance Extreme durability Attention: Electrically conductive! Follow instructions!

The AM5 High Performance Heatspreader is an upgrade for AMD's Ryzen 7000 CPUs. The heatspreader's precision diamond-milled nickel-plated copper surface provides 240% more surface area. As a result, the AM5 heatspreader allows for maximum heat dissipation with air and water coolers.

The AM5 Mycro Direct-Die RGB is a water cooler for AMD's Ryzen 7000 processors that sits directly on the chiplets of a delidded CPU. Made of nickel-plated copper, the Direct-Die water cooler offers outstanding thermal conductivity. This is further increased by an optimized structure of the microfins on the top. In addition, compared to normal water cooling, direct-die cooling eliminates the need for a layer of thermal conductive material as well as the CPU's heatspreader. This significantly improves the heat transfer from the CPU to the water cooling circuit.

The AM5 Mycro Direct-Die is a water cooler for AMD's Ryzen 7000 processors that sits directly on the chiplets of a delidded CPU. Made of nickel-plated copper, the Direct-Die water cooler offers outstanding thermal conductivity. This is further increased by an optimized structure of the microfins on the top. In addition, compared to a normal water cooler, Direct-Die cooling eliminates a layer of thermal conductive material as well as the CPU's heatspreader. This significantly improves the heat transfer from the CPU to the water cooling circuit. The top part of the AM5 Mycro Direct-Die is made of CNC-machined polyoxymethylene (POM) and is equipped with one inlet and outlet each in the form of G1/4-inch threads.

Thermische pasta X-10 levert uitstekende thermische geleidbaarheid met lage weerstand en hogere viscositeit voor koele, stille en stabiele werking onder veeleisende workloads. Gebaseerd op een verbeterde, op siliconenolie gebaseerde draagstof met een hogere concentratie aluminium- en zinkoxidepoeder, is X-10 ontworpen voor optimale warmteoverdracht bij CPU- en GPU-koeling in zowel lucht- als vloeistofkoelsystemen, met eenvoudige applicatie voor zowel beginners als ervaren bouwers. Hoogviskeuze formule ontworpen voor processors met hoge warmteafgifte en weerstand tegen het pump-out-effect Siliconen-gebaseerde compound, niet elektrisch geleidend Applicatiehulpmiddelen inbegrepen: applicator en spatel met meerdere applicatiemethoden Helpt betrouwbare, consistente koeling te behouden voor stabiele prestaties wanneer je systeem onder belasting staat.

The Intel High Performance Heatspreader V1 is an upgrade heatspreader for Intel processors. The nickel-plated copper heatspreader has a 207 percent larger, diamond-milled precision surface. This increased surface area compared to the original heatspreader enables maximum heat dissipation for air and water coolers, while the precision milling ensures extremely low surface roughness for the best contact with the heat sink. The Intel High Performance Heatspreader V1 is compatible with the following processors: Intel 12th Gen CPUs Intel 13th Gen CPUs Intel 14th Gen CPUs (200s) Scope of delivery 1x Intel High Performance Heatspreader V1 4x pan-head screws UNC thread 3/8 1x hexagon socket wrench 5/64 1x angle wrench Torx T20

The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with very high thermal conductivity. Compared to Carbonaut pads, KryoSheet as a high-end product offers significantly higher thermal conductivity. This increased thermal conductivity is not only due to the choice of material, but also to the innovative manufacturing process. KryoSheet does not contain any liquid components and is therefore not subject to normal ageing as is the case with traditional thermal paste. Drying out is not possible. Outstanding thermal conductivity Easy to use Consistently high performance Extreme durability

Water cooler for direct?die mounting on AMD AM5 CPUs featuring a nickel?plated copper cold plate, a hybrid microfin structure with a jet plate for optimized flow and integrated ARGB lighting. The AMD Mycro Direct-Die Pro is engineered for delidded AM5 processors, replacing the SAM and heatspreader to sit directly on the silicon while the nickel plating limits gallium-based liquid metal diffusion and the hybrid fin design reduces flow resistance. Direct?die mounting for delidded CPUs (requires removal of Socket Actuation Mechanism) Nickel?plated copper cold plate with two sizes of microfins and jet plate Annealed acrylic under an anodized aluminum cover to prevent stress cracks Digital ARGB LEDs under the cover, controlled via 3?pin ARGB header (+5V/DATA/GND), LEDs illuminate the acrylic and G1/4 connectors G1/4?inch connections for coolant lines Compatibility: generally compatible with Ryzen 9000 series including X3D variants, not compatible with Ryzen 5 7400F or Ryzen 8000G APUs (As of September 2025) Includes insulation sheet, 600 mbar pressure test report, mounting screws and wrenches Provides direct?die cooling with optimized flow and integrated lighting while the nickel plating reduces the need for repeated liquid?metal applications.

Thermische pad, antraciet

Thermal pad levert de prestaties van de Thermal Grizzly KryoSheet grafenen thermal pad in een formaat van 75 × 72 mm met een aanpasbaar oppervlak en zeer hoge thermische geleidbaarheid, geleverd met een Kapton-isolatievel. Thermal Grizzly TG-KS-75-72 is ontworpen als alternatief voor koelpasta in het hogere prestatiesegment, met een grafeenpad zonder vloeibare componenten om normale veroudering te voorkomen en het risico op uitdrogen te elimineren. KryoSheet grafenen thermal pad voor onderdelen/accessoires van computerkoelsystemen Aanpasbaar oppervlak met zeer hoge thermische geleidbaarheid Aanzienlijk hogere thermische geleidbaarheid dan Carbonaut pads Innovatief productieproces Geen vloeibare componenten voor langdurige stabiliteit zonder uitdrogen Inclusief Kapton-isolatievel Betrouwbare, pasta-vrije thermische interface voor schone, consistente CPU-koelprestaties.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules. Excellent thermal conductivity High compressibility Easy to use Electrically non-conductive Comparison of the Minus Pad Basic-, Advance-, and Pro series: Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio. Minus Pad Advance: Improved thermal conductivity, higher compressibility. Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility - at a slightly higher Price.

Thermal pads offer improved thermal conductivity, high compressibility and electrical insulation for reliable heat transfer on SSDs, GPU coolers and other electronic components. The Minus Pad Advance series refines the proven Minus Pad 8 formula with enhanced thermal performance and easier handling, making it suitable for SSDs, GPU water coolers, voltage regulators and memory modules. Electrically non-conductive for safe component contact Excellent thermal conductivity to aid heat dissipation High compressibility for better surface conformity Easy to use on a variety of cooling applications Designed to improve heat transfer in compact cooling setups while remaining simple to apply.

Thermal pads with improved thermal conductivity, high compressibility and electrical insulation for effective heat transfer on SSDs, GPU coolers and electronic components. The Minus Pad Advance pads are easy to use and were developed from the Minus Pad 8 to deliver improved thermal conductivity and higher compressibility. Excellent thermal conductivity High compressibility for better surface contact Electrically non-conductive Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules Improved price-performance ratio Designed to provide reliable heat transfer and gap filling across a range of PC and electronic cooling applications.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules. Excellent thermal conductivity High compressibility Easy to use Electrically non-conductive Comparison of the Minus Pad Basic-, Advance-, and Pro series: Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio. Minus Pad Advance: Improved thermal conductivity, higher compressibility. Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility - at a slightly higher Price.

Thermal pad with extremely high thermal conductivity, outstanding compressibility and electrical non-conductivity for reliable heat transfer on SSDs, GPU coolers and electronic components. The Minus Pad Pro is part of the Minus Pad series and builds on the proven Minus Pad 8 to deliver improved thermal conductivity and compressibility while remaining easy to use. Excellent thermal conductivity Outstanding compressibility Easy to use Electrically non-conductive Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules Color: gray Provides a compressible, electrically isolating interface to enhance thermal contact between components and cooling solutions.

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components. The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules. Excellent thermal conductivity Outstanding compressibility for better surface contact Electrically non-conductive Easy to use and install Designed for use with SSDs, GPUs, water coolers and electronic components Part of the Minus Pad Basic, Advance and Pro series, further developed from Minus Pad 8 Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.

Thermally conductive gap filler to replace GPU thermal pads, with an operating temperature range of -40°C to +120°C. TG Putty is a thermally conductive compound intended for GPU applications, offered in multiple sizes and performance variants. Replaces standard GPU thermal pads to bridge uneven surfaces Operating temperature: -40°C to +120°C Available contents: 30 g and 100 g Available variants: Basic, Advance, Pro Datasheet and technical information available for download Ensures reliable thermal contact across gaps to support heat transfer between GPU components.