Opslagapparaten (10.000)

Storage enclosure, 2.5, SATA 6Gb/s, USB 3.0

USB-flashstation, 32 GB, USB 2.0 / micro USB, zwart/zilver

USB-stick, 8 GB, USB 2.0

De BXPPABSG200300130-F01 Boxexpert uit de Fleet serie is een wandkast-behuizing van ABS-kunststof met 1-puntsvergrendeling die perfect is voor zowel binnen- als buitengebruik. Hij is eenvoudig te...

De BXPPABSG300400170-F01 Boxexpert uit de serie Fleet is een wandkast van ABS kunststof met 2-punts sluiting, die zowel voor binnen als voor buitengebruik perfect geschikt is. Hij is eenvoudig te...

De serie Fleet black-line van BOXEXPERT is een wandkast van ABS-kunststof in de Fabre zwart met 1-punts sluiting in de grootte 200x300x130mm en vanaf 250x350x150mm tot 400x600x200mm met 2-punts...

De serie Fleet blackline transparant van BOXEXPERT is een wandkast van ABS kunststof in de Fabre zwart met transparante deur met 1-punts sluiting in de grootte 200x300x130mm en vanaf 250x350x150mm tot...

Netadapter met 2000 mA voor het opladen van alle lampen, smartphones, tablets, enzovoort....

Thermal Grizzly TG-MP8-30-30-05-1R Warmtegeleidend pad 1 stuk(s)

Door het afvoeren van hitte verlengt de koeler de levensduur van de SSD en vermindert het de kans op oververhitting.Deze behuizing is gemaakt van stevig aluminium en bevat heatsinks, zodat je SSD goed gekoeld blijft.Je bouwt de M.2 SSD eenvoudig in of uit de behuizing, een schroevendraaier is niet nodig.Dit product bevat geen M.2 SSD, het is enkel een behuizing.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %. Most excellent thermal conductivity No bleeding long-term stability high compression rate The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. NB: Due to the consistency only one-time use is recommended

Vloeibare metaalkoelpasta, zilverpasta, dichtheid: 6,29 g/cm³, bedrijfstemperatuur: -50 - 200° C, 1 gram

Short back plate for AM5 motherboard, for mounting AM4 coolers with custom retaining kit on AM5, made from black anodised aluminium

CPU contact frame voor Intel 13th gen Intel Raptor Lake & 14th gen Raptor Lake-S, kan helpen bij het verbeteren van de koelprestaties met beter contact tussen CPU en koeler - bekijk alstublieft de installatievideo voordat u installeert

Thermal Grizzly presents the WireView GPU, a device for measuring the power consumption of PCI expansion and plug-in cards, which was developed in collaboration with Jon „elmor“ Sandström. At the same time, the U-shaped design of the adapter enables optimised cable routing for clean cable management. What does the WireView GPU do? The WireView GPU enables the measurement of the power consumption of PCI expansion and plug-in cards and logs this data to determine the power consumption. This data can be used, among other things, to determine the power costs of a graphics card or to compare the power consumption with other graphics cards - and just plain looks cool! - 1 x 16-Pins PCI-E - reversed direction

Thermal Grizzly presents the WireView GPU, a device for measuring the power consumption of PCI expansion and plug-in cards, which was developed in collaboration with Jon „elmor“ Sandström. At the same time, the U-shaped design of the adapter enables optimised cable routing for clean cable management. What does the WireView GPU do? The WireView GPU enables the measurement of the power consumption of PCI expansion and plug-in cards and logs this data to determine the power consumption. This data can be used, among other things, to determine the power costs of a graphics card or to compare the power consumption with other graphics cards - and just plain looks cool! - 1x 12VHPWR -> 3 x 8-Pins PCI-E - normal direction

CPU-montageframe maakt direct-die montage mogelijk voor AMD Ryzen 7000-processors op AM5 door de geïntegreerde heat spreader weg te laten, voor aanzienlijk lagere bedrijfstemperaturen. Thermal Grizzly Ryzen 7000 Direct Die Frame laat je CPU-koeler direct contact maken met de chiplets van de processor voor efficiëntere warmteafvoer, terwijl het helpt de blootliggende chiplets te beschermen tegen contactdruk die de CPU-functie kan beïnvloeden. Compatibel met AMD Ryzen 7000 (incl. Ryzen 7000 V2) Maakt montage van delidded Ryzen-CPU's mogelijk Eenvoudige montage Geanodiseerde aluminium constructie in zwart Ideaal voor extreme overclockers, gamers en content creators die betere koeling zoeken via directe warmteoverdracht.

CPU Contact Frame improves cooling by shifting contact pressure to the edges, preventing IHS concavity and enabling better cooler contact on Intel LGA1700 sockets. The Thermal Grizzly CPU Contact Frame Intel 1700 LT is the injection-molded Lite mounting frame made from ABS reinforced with 15% glass fiber that replaces the standard ILM to increase contact surface and simplify installation. Injection-molded ABS with 15% glass fiber for added stability Inner contour shifts pressure from centre to edges to avoid concave IHS Designed for Intel LGA1700, compatible with 12th, 13th and 14th Gen CPUs Only for CPUs whose IHS has been ground down by no more than 0.2 mm Includes 4 pan-head screws (UNC 3/8), 5/64 hex socket wrench and Torx T20 angle wrench Simple installation and improved cooler contact can lead to noticeably lower CPU temperatures depending on the cooler and processor.

Thermal putty is an electrically non-conductive, flexible gap filler that replaces conventional thermal pads on GPUs and bridges height differences from 0.2 to 3.0 mm. Formulated for GPU modifications, TG Putty is easy to shape for precise contact with VRAM and SMD components and can be applied broadly with a spatula or formed by hand. Electrically non-conductive alternative to thermal pads Fills gaps from 0.2 to 3.0 mm for consistent contact Apply with spatulas or by hand (gloves recommended) Available in variants with different thermal conductivities Operating range ?40°C to +120°C Not suitable for use on processors (IHS or direct die) or directly on the GPU die Easy to shape and tailor-made for memory and voltage-regulator contacts, it simplifies GPU pad replacement and cooler modifications.

Thermal putty acts as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates height differences from 0.2 mm to 3.0 mm while remaining easy to apply. The TG Putty line is available in three variants with differing thermal conductivity and is supplied with spatulas to enable straightforward, large-area application. Electrically non-conductive alternative to conventional thermal pads Compensates gaps from 0.2-3.0 mm Three variants: Basic (medium), Advance (good), Pro (excellent) thermal conductivity Includes three spatulas for application Operating temperature range ?40°C to +120°C Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die Apply only to clean, degreased surfaces (e.g., TG Cleaning Wipes or isopropanol) Suited for replacing VRAM and VRM pads on single and larger graphics cards and for converting coolers to GPU water cooling setups.

Thermal putty that serves as an electrically non-conductive, flexible gap filler for replacing thermal pads on GPUs and compensates for height differences from 0.2 to 3.0 mm. TG Putty is easy to apply with the supplied spatulas or by hand (gloves recommended) and is available in Basic, Advance and Pro variants that differ by thermal conductivity. Electrically non-conductive alternative to conventional thermal pads Fills gaps from 0.2-3.0 mm for VRAM, VRM and SMD components Apply broadly with spatulas or shape into small pellets for precise placement Not suitable for use on processors (IHS or Direct Die) or directly on the GPU die Operating temperature range ?40°C to +120°C Advance variant includes three spatulas for application Designed for GPU modifications and cooler conversions, it adapts to varied factory pad thicknesses for tailored thermal contact.

With the Thermal Grizzly Minus Pad Advance, the Hamburg-based cooling specialist is expanding its product range with advanced thermal pads. Based on their predecessor, the Minus Pad 8, they have been further developed to significantly improve thermal conductivity. The Minus Pad Advance is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and the heat sink needs to be bridged. It is therefore ideal for use with memory chips or voltage converters. It is based on a silicone-based carrier complex and aluminum oxide as a heat transfer medium, thus achieving thermal conductivity similar to thermal paste. The Minus Pad is available in various dimensions and thicknesses from 0.5 to 3 millimeters. Since it works optimally even with minimal contact pressure and thermal conductivity is barely affected by the thickness, the choice of thickness should simply be tailored to the distance to be bridged.

Thermal pads provide improved thermal conductivity and high compressibility for efficient heat transfer in SSDs, GPU coolers, water coolers and other electronic components. The electrically non-conductive Minus Pad Advance builds on the proven Minus Pad 8 design and was developed to improve thermal conductivity and compressibility while remaining easy to use. Excellent thermal conductivity High compressibility for uneven surfaces Easy to apply and handle Electrically non-conductive Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules Designed for straightforward installation, these pads help maintain effective thermal contact across a range of PC and electronics cooling applications.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules. Excellent thermal conductivity High compressibility Easy to use Electrically non-conductive Comparison of the Minus Pad Basic-, Advance-, and Pro series: Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio. Minus Pad Advance: Improved thermal conductivity, higher compressibility. Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility - at a slightly higher Price.

Thermische pad, zwart (pak van 2)

Thermal pad levert uitzonderlijk hoge samendrukbaarheid met uitstekende thermische geleidbaarheid, ontworpen om zich aan te passen aan uiteenlopende hoogteverschillen tussen componenten. TG Minus Pad High Compression is bijzonder praktisch voor modificaties aan grafische kaarten met een GPU-waterkoeler of bij het vervangen van pads op een GPU-koeler, waarbij één pad meerdere toleranties op VRAM, spanningsregelaars en andere contactoppervlakken in dezelfde setup kan overbruggen. Behoudt thermische geleidbaarheid onder zware compressie en kan toenemen bij hogere contactdruk Past zich goed aan hoogte-toleranties aan wanneer de exacte paddikte onbekend is Elektrisch niet-geleidend Eenvoudig te hanteren en zeer veelzijdig in toepassing Biedt betrouwbaar contact over ongelijkmatige oppervlakken voor consistentere warmteoverdracht in veeleisende builds.

Inbouwnetvoeding voor 12V DC voor home automation en Smart home toepassingen. De teksten voor dit artikel zijn automatisch vertaald....

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De Scythe Mugen 6 Black Edition ARGB is een geavanceerde CPU-luchtkoeler met twee 120 mm ARGB-ventilatoren, ontworpen voor uitstekende thermische prestaties. Dankzij de brede socketcompatibiliteit ondersteunt deze koeler zowel Intel-processors (tot en met LGA2066) als AMD-platformen zoals AM4 en AM5, waardoor hij geschikt is voor uiteenlopende systemen. Met een hoogte van 154 mm heeft de Mugen 6 een compact ontwerp dat in de meeste gangbare pc-behuizingen past. De combinatie van aluminium, koper en nikkel zorgt voor efficiënte warmteoverdracht en stabiele koelprestaties. Met een maximaal geluidsniveau van 35,6 dB blijft de koeler relatief stil tijdens gebruik. De geïntegreerde ARGB-verlichting biedt bovendien uitgebreide mogelijkheden voor personalisatie en naadloze integratie in moderne builds.

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