Koelingonderdelen voor computersystemen (125)

Warmteafleider processor, voor ProLiant DL385 Gen10 Plus V2, DL385 Gen10 Plus V2 Base, DL385 Gen10 Plus V2 Entry

Opslagkabelkit, x4 NVMe-aansluiting, voor ProLiant DL560 Gen11 Networking Choice

Ventilatorkit voor systeem, 2U, voor ProLiant DL145

Warmteafleider processor

VEVOR CPU-vloeistofkoeler, AIO CPU-waterkoeler, 3x 120 mm PWN-ventilatoren, pomp en 53 mm LCD-scherm, max. 2200 RPM CPU-koelventilator, compatibel met Intel 115X/1366/2011/1700/1200, AMD AM4/AM5koelbuiskoellichaamfanSterke luchtstroom, weinig geluidCompatibiliteit van Intel en AMDDuurzaam en betrouwbaar ontwerpArtikelmodelnummer: YC-01-SS-004, Materiaal: ABS + PC + aluminium, Productgewicht: 3,59 lbs / 1,63 kg, Productafmetingen: 15,83 x 4,72 x 2,2 inch / 402 x 120 x 56 mm, Nominale spanning/stroom: 12 V DC, 0,9 A

EK 3831109814543 onderdeel & accessoire voor computerkoelsystemen Waterblok

EK-Quantum Kinetic TBE D5 combo unit is de revolutie van het meest populaire ontwerp voor pomp-reservoir assemblages op de markt. De nieuwe Kinetic combo units maken deel uit van de EK Quantum Line of products en worden geleverd met geavanceerde adresseerbare D-RGB verlichting en een echte D5-pomp!

Vloeistofkoelsysteem CPU waterblok, (voor: LGA1700), nickel and acetal

Koeler voor processor, voor PRIMERGY RX2530 M4, RX2530 M4 Liquid Cooling, RX2530 M5, RX2530 M5 Liquid Cooling

Processor koeler, voor PRIMERGY RX2530 M6

Koelset, voor 2e CPU, voor PRIMERGY RX2540 M6

Liquid cooling system tubes bending and measuring tool kit

Vloeistofkoelsysteem processor, (voor: LGA1156, AM2, AM2+, LGA1366, AM3, LGA1155, AM3+, LGA2011, FM1, LGA1150, LGA2011-3, LGA1151, AM4, LGA2066, TR4, sTRX4, LGA1200), koper, 120 mm

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %. Most excellent thermal conductivity No bleeding long-term stability high compression rate The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. NB: Due to the consistency only one-time use is recommended

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %. Most excellent thermal conductivity No bleeding long-term stability high compression rate The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. NB: Due to the consistency only one-time use is recommended

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %. Most excellent thermal conductivity No bleeding long-term stability high compression rate The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. NB: Due to the consistency only one-time use is recommended

The AM5 Mycro Direct-Die is a water cooler for AMD's Ryzen 7000 processors that sits directly on the chiplets of a delidded CPU. Made of nickel-plated copper, the Direct-Die water cooler offers outstanding thermal conductivity. This is further increased by an optimized structure of the microfins on the top. In addition, compared to a normal water cooler, Direct-Die cooling eliminates a layer of thermal conductive material as well as the CPU's heatspreader. This significantly improves the heat transfer from the CPU to the water cooling circuit. The top part of the AM5 Mycro Direct-Die is made of CNC-machined polyoxymethylene (POM) and is equipped with one inlet and outlet each in the form of G1/4-inch threads.

Water cooler for direct?die mounting on AMD AM5 CPUs featuring a nickel?plated copper cold plate, a hybrid microfin structure with a jet plate for optimized flow and integrated ARGB lighting. The AMD Mycro Direct-Die Pro is engineered for delidded AM5 processors, replacing the SAM and heatspreader to sit directly on the silicon while the nickel plating limits gallium-based liquid metal diffusion and the hybrid fin design reduces flow resistance. Direct?die mounting for delidded CPUs (requires removal of Socket Actuation Mechanism) Nickel?plated copper cold plate with two sizes of microfins and jet plate Annealed acrylic under an anodized aluminum cover to prevent stress cracks Digital ARGB LEDs under the cover, controlled via 3?pin ARGB header (+5V/DATA/GND), LEDs illuminate the acrylic and G1/4 connectors G1/4?inch connections for coolant lines Compatibility: generally compatible with Ryzen 9000 series including X3D variants, not compatible with Ryzen 5 7400F or Ryzen 8000G APUs (As of September 2025) Includes insulation sheet, 600 mbar pressure test report, mounting screws and wrenches Provides direct?die cooling with optimized flow and integrated lighting while the nickel plating reduces the need for repeated liquid?metal applications.

Liquid cooler with an onboard digital display for real-time CPU and GPU temperature readouts, a Supreme Water Pump, and three E28 ARGB fans for focused heat dissipation. The HyperFlow Digital 360 pairs a slim high-density 20 FPI radiator with a powerful pump and visible temperature monitoring to deliver sustained thermal performance and easy system oversight. Built-in digital display shows real-time CPU and GPU temperatures with Celsius/Fahrenheit toggle Three E28 ARGB fans (120×120×28mm) with speeds up to 2200 RPM and up to 96.27 CFM airflow 27mm thin, high-density 20 FPI aluminum radiator for efficient heat dissipation in compact builds Pre-installed fans and pre-applied thermal paste for quick, clean installation Supports modern Intel (1151/1200/1700/1851/20XX) and AMD (AM3/AM4/AM5) sockets Pump rated at ~3100 RPM with ARGB lighting and standard 5V 3-pin connectors Designed to make temperature monitoring visible and installation straightforward for clean, performance-focused PC builds.

Liquid cooler with an onboard digital display for real-time CPU and GPU temperature readouts, a Supreme Water Pump, and three E28 ARGB fans for focused heat dissipation. The HyperFlow Digital 360 pairs a slim high-density 20 FPI radiator with a powerful pump and visible temperature monitoring to deliver sustained thermal performance and easy system oversight. Built-in digital display shows real-time CPU and GPU temperatures with Celsius/Fahrenheit toggle Three E28 ARGB fans (120×120×28mm) with speeds up to 2200 RPM and up to 96.27 CFM airflow 27mm thin, high-density 20 FPI aluminum radiator for efficient heat dissipation in compact builds Pre-installed fans and pre-applied thermal paste for quick, clean installation Supports modern Intel (1151/1200/1700/1851/20XX) and AMD (AM3/AM4/AM5) sockets Pump rated at ~3100 RPM with ARGB lighting and standard 5V 3-pin connectors Designed to make temperature monitoring visible and installation straightforward for clean, performance-focused PC builds.

Vloeistofkoelsysteem processor, (voor: LGA775, LGA1156, AM2, AM2+, AM3, LGA1155, AM3+, LGA2011, FM1, FM2, LGA1150, LGA1151, AM4, LGA2066, LGA1200), koper, 120 mm

Vloeistofkoelsysteem processor, afmeting radiator: 280 mm, (voor: LGA1156, AM2, LGA1366, AM3, LGA1155, LGA2011, FM1, FM2, LGA1150, LGA1151, AM4, LGA2066, TR4, sTRX4, LGA1200), koper, 140 mm

Vloeistofkoelsysteem processor, afmeting radiator: 240 mm, (voor: LGA1156, AM2, AM3, LGA1155, LGA2011, FM1, FM2, LGA1150, LGA1151, AM4, LGA2066, LGA1200, LGA1152, LGA1700), koper, 120 mm

Vloeistofkoelsysteem processor, afmeting radiator: 360 mm, (voor: LGA1156, AM2, AM3, LGA1155, LGA2011, FM1, FM2, LGA1150, LGA1151, AM4, LGA2066, LGA1200, LGA1152, LGA1700), koper, 120 mm

Vloeistofkoelsysteem processor, afmeting radiator: 360 mm, (voor: AM2, AM3, LGA1155, LGA2011, FM1, FM2, LGA1150, LGA1151, AM4, LGA2066, LGA1200, LGA1152, LGA1700), koper, 120 mm, zuiver wit

Silverstone SST-XE04-SP5B CPU-Kühler, AMD SP5 - silber

CPU koeler, alles-in-één waterkoeler, compatibel met AMD Socket AM4 / AM5 & Intel Socket LGA1150 / LGA1151 / LGA1155 / LGA1156 / LGA1200 / LGA1700 / LGA1851, pomp: Asetek 8th gen, koeler geluidsniveau: max 36.45 dBA, koeler RPM: max 2200 ± 10%, koeler CFM: max 70.07, radiator: max 3.88 mmH?O, PWM-gestuurd, 399.5mm radiator met 3 x 120mm RGB koelers, 4-Pins PWM & 3-Pins ARGB aansluiting, incl. koelpasta, wit met RGB (gecontrolleerd door: ASUS AURA)•

Vloeistofkoelsysteem processor, afmeting radiator: 360 mm, (voor: LGA1156, LGA1155, LGA2011, LGA1150, LGA2011-3, LGA1151, AM4, LGA2066, TR4, LGA1200, LGA1700, AM5), koper, 120 mm

Vloeistofkoelsysteem processor, afmeting radiator: 360 mm, (voor: LGA1150, LGA1151, LGA1155, LGA1156, LGA1200, LGA1700, AM4, AM5, TR4, sTRX4), koperen basis, 120 mm

White Edition, vloeistofkoelsysteem processor, afmeting radiator: 240 mm, (voor: AM4, TR4, LGA1200, LGA1700, AM5, LGA115x Socket), koper, 120 mm, wit

All-in-one liquid CPU cooler with a 2.8 IPS LCD, pre-installed triple ARGB fans and an upgraded three-phase pump that boosts efficiency, increases lifespan and reduces noise for improved thermal performance. The TUF Gaming LC III 360 ARGB LCD White Edition combines a customizable 2.8 display for animated GIFs, MP4s and live hardware monitoring with integrated ARGB fans that simplify installation via a dual?connector cable for power/signals and lighting. Upgraded pump: three-phase, six-slot, four-pole design for up to 30% improved efficiency and longer service life Pre-installed integrated ARGB fans delivering high airflow and static pressure with anti-vibration rubber mounts Fan specs: 2600 ±10% RPM, 3.82 mmH2O static pressure, 90.78 CFM airflow, 37.4 dB(A) noise 2.8 IPS LCD shows clock mode, voltages, temperatures, fan speeds and supports custom images, GIFs and MP4s ASUS InfoHub software for intuitive LCD control and real-time hardware status Reinforced sleeved 400 mm tubing and braided LCD/pump header cables for durability and easier cable management Pre-applied thermal paste and compatibility with Intel LGA 1851/1700/1200 and AMD AM5/AM4 sockets Customizable visuals and robust cooling combine to keep system temperatures stable while adding a focal point to your build.

Snow Edition, vloeistofkoelsysteem processor, afmeting radiator: 240 mm, (voor: LGA2066, LGA2011-3, LGA2011, LGA1700, LGA1200, LGA1156, LGA1155, LGA1151, LGA1150, AM5, AM4, AM3+, AM3, AM2, FM2, FM1), koper, 120 mm

Snow Edition, vloeistofkoelsysteem processor, afmeting radiator: 360 mm, (voor: LGA1156, AM2, AM2+, AM3, LGA1155, AM3+, LGA2011, FM1, FM2, LGA1150, LGA2011-3, LGA1151, AM4, LGA2066, LGA1200, LGA1700, AM5), koper, 120 mm, sneeuw

Vloeistofkoelsysteem processor, (voor: LGA2066, LGA2011, LGA1700, LGA1200, LGA1156, LGA1155, LGA1151, LGA1150, AM5, AM4, AM3+, AM3, AM2+, AM2), koper, 140 mm, zwart

Vloeistofkoelsysteem processor, afmeting radiator: 420 mm, (voor: LGA4677, SP6, sTR5), vernikkelde koperen basis, 140 mm, zwart

The DE360 CPU water cooler in black delivers high-performance cooling with a modern design. It features a 2.88-inch magnetic IPS screen that displays CPU temperature, fan speed, and operational modes in real time, and can be detached and mounted on any metal surface inside the chassis. Three 120 mm PWM ARGB fans provide efficient airflow, keeping processors with TDPs up to 315 W cool. The precision-cut copper base ensures fast heat transfer, while the included software allows customization of display themes and ARGB lighting. Compatible with Intel LGA 115x/1200/1700/1851 and AMD AM3/AM4/AM5.